NSN 5962-01-387-5822

Part Details | MEMORY MICROCIRCUIT

5962-01-387-5822 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: 59628686401LA, 5962-8686401LA, ROMPROM FAMILY 176, ROM/PROM FAMILY 176, SMA8394811, SM-A-839481-1, SMA8394811, SM-A-839481-1, 5962-01-387-5822, 01-387-5822, 5962013875822, 013875822

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59MAR 08, 199401-387-582241015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-387-5822
Part Number Cage Code Manufacturer
5962-8686401LA67268DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
ROM/PROM FAMILY 17616236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
SM-A-839481-104655GENERAL DYNAMICS MISSION SYSTEMS,INC.
SM-A-839481-180063US ARMY COMMUNICATIONS &ELECTRONICS MATERIEL READINESS
Technical Data | NSN 5962-01-387-5822
Characteristic Specifications
OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV7.0 VOLTS MAXIMUM
CURRENT RATING PER CHARACTERISTICBACHG60.00 MILLIAMPERES NOMINAL
TIME RATING PER CHACTERISTICNSCADR55.00 NANOSECONDS
MEMORY DEVICE TYPE PAL
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION DUAL-IN-LINE
INCLOSURE MATERIAL CERAMIC
CASE OUTLINE SOURCE AND DESIGNATORD-9 MIL-M-38510
MAXIMUM POWER DISSIPATION RATING650.0 MILLIWATTS
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND PROGRAMMED
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).