NSN 5962-01-418-3938

Part Details | MEMORY MICROCIRCUIT

5962-01-418-3938 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: ROMPROM, ROM/PROM, 7548298G23, 7548298G0023, 7542104P502, 93Z511LMQB, 82S191AB3A, 82S191A/B3A, 5962-01-418-3938, 01-418-3938, 5962014183938, 014183938

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59AUG 25, 199501-418-393841015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-418-3938
Part Number Cage Code Manufacturer
ROM/PROM16236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
7548298G2399971LOCKHEED MARTIN CORPNAVAL ELECTRONICS & SURVEILLANCE
7548298G002399971LOCKHEED MARTIN CORPNAVAL ELECTRONICS & SURVEILLANCE
7542104P50299971LOCKHEED MARTIN CORPNAVAL ELECTRONICS & SURVEILLANCE
93Z511LMQB27014NATIONAL SEMICONDUCTOR CORPORATION
82S191A/B3A18324PHILIPS SEMICONDUCTORS INC
Technical Data | NSN 5962-01-418-3938
Characteristic Specifications
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV5.5 VOLTS NOMINAL
TIME RATING PER CHACTERISTICNSCADR70.00 NANOSECONDS
MEMORY DEVICE TYPE ROM
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY28 LEADLESS
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION LEADLESS FLAT PACK
INCLOSURE MATERIAL CERAMIC
PART NAME ASSIGNED BY CONTROLLING AGENCYPROGRAMMED PROM