NSN 5962-01-421-1336
Part Details | MEMORY MICROCIRCUIT
5962-01-421-1336 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: MB846415CVWSC, MB8464-15CV-W-SC, 17020801, 170208-01, 5962-01-421-1336, 01-421-1336, 5962014211336, 014211336
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | NOV 02, 1995 | 01-421-1336 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-421-1336
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| MB8464-15CV-W-SC | 61271 | FUJITSU MICROELECTRONICS INC. |
| 170208-01 | 35351 | GE AVIATION SYSTEMS LLC |
Technical Data | NSN 5962-01-421-1336
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV7.0 VOLTS MAXIMUM |
| TIME RATING PER CHACTERISTIC | NSCAEE150.00 NANOSECONDS AND NSCAED150.00 NANOSECONDS |
| MEMORY DEVICE TYPE | RAM |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
| INCLOSURE MATERIAL | CERAMIC |
| MAXIMUM POWER DISSIPATION RATING | 495.0 MILLIWATTS |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND LOW POWER |
| NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |